During this period, we have developed our expertise and equipment to a professional level.
Our 10 colleagues collectively have over 150 years of work experience in the testing and fault analysis of automotive electronic products.
For 20 years, we have been providing fault detection and analysis services to our customers.
Our services
We offer the following services with short lead times:
- Optical microscopic examinations
- X-ray examinations
- SEM analysis (material composition, comparison)
- CT examinations
- Seal integrity / breakdown voltage – insulation resistance testing
- Chemical removal of plastics
- Analog measurements, monitoring even under temperature conditions
- Digital communication monitoring
- DMM multiplex measurements on multiple channels simultaneously
- Rentable, portable, measuring equipment
- Professional, custom, micro-electronic soldering (excluding BGA)
Non-destructive testing focusing on faults/defects such as:
- Fractures
- Cracks
- Breaks
- Soldering defects
- Assembly issues
- Homogeneity
- Foreign materials
- Inclusions
Maximum inspectable size/weight: 680 mm x 635 mm (27" x 25") / 10 kg (22 lbs.)
- X-ray
- 2D X-ray
Non-destructive testing where hundreds of X-ray images are taken of the examined object while rotating it around an axis. These 2D images are then used to software-build a 3D model of the object.
The 3D model can be rotated, sliced, and examined in any direction, revealing internal issues such as:
- Fractures
- Cracks
- Breaks
- Soldering defects
- Assembly issues
- Homogeneity
- Foreign materials
- Inclusions
Maximum inspectable size: 460 mm x 360 mm (18" x 14")
Scanning Electron Microscope
- Extra magnified imaging (ETD detector max 2000X)
- Material composition determination (EDX detector)
- Material density mapping (BSED detector)
- Material composition comparison to reference samples
- SEM analysis
- SEM analysis
Certain tests can be performed under various temperature parameters. Our calibrated thermal chambers (-40 °C to +160 °C) allow for testing under custom temperature profiles, helping to identify mechanical-origin faults, such as contact errors, microcracks, soldering, or bonding issues.
Maximum capacity: 700x800x400 mm
Programmable temperature change rate:max 5 °C/min
A chemical process using formic acid to remove specific types of plastic (polyamide) parts from the workpiece without damaging other components. Typical tasks include preparing products surrounded by thermoplastic materials for further visual or electrical testing.
- PA 6.12
- PPA
Our equipment enables proper sampling to monitor analog signals, running long tests, lasting days, and even simultaneously working on multiple samples.
We develop custom software for the desired measurements, data recording, and/or processing.
Analog input:
- Ananlog inputs: 8 differential or 16 single-ended
- Resolution: 16-bit ADC
- Maximum sampling rate: 2MS/sec per channel
- Average sampling rate for multiple channels: 1MS/sec
- Maximum time base resolution: 10ns
- Timing accuracy: 50ppm/sample rate
- Input signal range: max ±10V
PWM, frequency measurement:
- 4 32-bit counter/timer inputs
- Ânalogue signal monitoring - torque chart
- Ânalogue signal monitoring - raw data
Our PC-based (USB-connected) 8-channel logic analyser, with a maximum digital sampling rate of 500MS/sec and 8-channel maximum analogue input sampling rate of 50MS/sec (12-bit / 5MHz bandwidth), can decode the following protocols:
- SPI
- I2C
- Atmel SWI
- Biss-C
- CAN
- DMX-512
- HD44780
- HDLC
- I2S
- JTAG
- LIN
- MDIO
- MIDI
- Manchester
If multiple samples (max of 20) need to be tested under the same conditions simultaneously, our multiplex measurement equipment is available.
- Resolution: 22-bit / 16-bit• 20-channel differential multiplexer input
- Portable equipment, easily deployable to external locations or next to production lines
- AC breakdown voltage measurement and testing
- DC breakdown voltage measurement and testing
- Insulation resistance measurement and testing
- Configurable ramp-up and ramp-down times, loggable results
Maximum dimensions: 400mm(W) x 400mm(H) x 340mm(D)
We have extensive experience in custom manual soldering of specialized micro-electronic components/units down to 0.1 mm.
- Prototype boards
- IC sockets
- Specialized cables
- Insulation tester: Kikusui TOS9301, GW Instek GPT-9804
- Climate chamber: Espec ARG-0220 AE, Espec SU-662
- Oscilloscope: LeCroy WaveSurfer 3024z, Agilent Vision DSO-X 4023A, NI USB5133
- RLC meter: Hioki 3511-50, Hameg HM8118, GW Instek LCR-819
- Vacuum chamber: Binder VD 53
- Optical microscope: Olympus SZX10, Nikon SMZ 800N, Nikon ECLIPSE LV150N
- Multimeter: Keithley 2000, Keithley 2700
- Data logger: Graphtech GL820
- Electron microscope (SEM): Thermo Scientific Q250
- I-V characteristic meter: Keithley 2400
- X-ray (CT): Phoenix Micromex 180, VG studio MAX 3.0
- Function generator: Instek AFG-2005
Get in contact with our expert team!
If the service you are looking for is not listed, please feel free to contact us with your specific requirements.